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XTech introduces AMC and MicroTCA faceplates with adjustable baffles
October 31, 2008
RANDOLPH, Mass., — Controlling thermal behavior and heat buildup within a chassis is a persistent challenge for manufacturers and designers of embedded systems.
Addressing the issue for AMC and MicroTCA applications, XTech solutions engineers have created faceplate assemblies with adjustable air baffles-offering increased control of chassis airflow through module-based impedance balancing.
The unique designs use sliding, slotted tracks secured by screws, as well as an externally controlled rotating vane.
The adjustable baffles are made with sturdy, lightweight aluminum. As seen in the photo, the units are available in an array of Mid- and Full-size configurations, offered in single and double width form factors.
AMC and MicroTCA faceplates with adjustable baffles from XTech
About XTech
Headquartered in Randolph, Massachusetts with offices worldwide, including a new manufacturing facility in Xiamen, China, XTech (also known as Extrusion Technology) is an innovative and leading manufacturer of mechanical solutions for circuit board mounting systems. XTech enclosures and front panels are used widely throughout the electronics, telecommunications, GPS, wireless equipment, and networking industries. XTech clients include many of the leading telecom OEMs, such as Lucent Technologies, Motorola, Marconi, Juniper Networks, Ciena, and others. Founded in 1945, XTech is privately held.
For further information, visit the company's web site at www.extrutech.com or call 781-963-7200.
| Contacts: | |
| Rick Winter Director, Sales and Marketing Extrusion Technology 781-963-7200, ext. 112 rwinter@extrutech.com |
Bob Boucher Cole & Co., Inc. 617-236-4699 bobb@cole-co.com |