XTech Introduces FMC Mounting System

Enables Merger of AMC and VITA 57/FMC Technology

Randolph, MA — XTech, a leading manufacturer of mechanical solutions for circuit boards and embedded systems, today announced that it has launched its FMC (FPGA Mezzanine Card) mounting system.

XTech's FMC system includes the new FMC bezel, gasket, and mating AMC faceplate solution in full-size or mid-size form factors, custom configured to specific application requirements.

"We found that, in the world of peripheral mezzanine cards, manufacturers of PMC modules needed a solution that provided compatibility with the AMC standard," said Rick Winter, XTech Director of Marketing and Sales. "An off-the-shelf solution was not available. The FMC form factor enables AMC and PMC technologies to merge in a new, mechanically sound solution."

About XTech
Headquartered in Randolph, Massachusetts with offices worldwide, including a new manufacturing facility in Xiamen, China, XTech (also known as Extrusion Technology) is an innovative and leading manufacturer of mechanical solutions for circuit board mounting systems. XTech enclosures and front panels are used widely throughout the electronics, telecommunications, GPS, wireless equipment, and networking industries. XTech clients include many of the leading telecom OEMs, such as Alcatel-Lucent, Motorola, Juniper Networks, Emerson, Ciena, and others. Founded in 1945, XTech is privately held.

For more information, contact XTech at 781-963-7200, or visit its website at www.xtech-outside.com.

Contacts:
Rick Winter Director, Sales and Marketing Extrusion Technology 781-963-7200, ext. 112 rwinter@extrutech.com	Bob Boucher VP, Creative Services, Cole & Co., Inc. 617-236-4699 bobb@cole-co.com