Posts Tagged ‘Rugged MicroTCA’

Patent on uTCA “No-Load” Fastener

Thursday, March 1st, 2012

CBT has just been awarded a patent for our “Threaded Fastener” design. You may wonder why CBT Technology, a company focused on front panel and enclosure solutions has a patent on a fastener, but it’s not that far of a stretch really.

As our company has grown and diversified over the years, we pride ourselves on being able to support many different types of components from modalities such as injection molding and die casting, along with our core competencies of aluminum extruding and sheet metal fabrication.

We are always interested in providing unique solutions for our customers, regardless of the path this takes us down. In this case, we became aware of the need for a special fastener while serving on the committee for the MicroTCA.1 Air Cooled Rugged Specification a few years ago. Required was a retention device with the ability to fasten a front panel to a subrack without producing excessive force toward the backplane, as this could cause undue stress on the connectors. To satisfy this need, we developed our “No-Load” fastener. This fastener actually neutralizes the screw driving force, yet fastens front panel to the nut bar.

Since the release of the MicroTCA.1 specification, the MicroTCA.4 spec has also adopted the requirement for this retention device.

While not the first fastener we have designed for our products or customers, this design was unique enough to merit a patent, #US 8,066,461 B2.

Please contact us for additional information: sales@cbttechnology.com

See the fastener in action:

The Legend of Simon Cowell and Jimmy Buffet

Monday, December 5th, 2011

by Steve Richardson

A Tale of the Hybrid Air/Conduction Cooled MicroTCA.2  Specification

 

When American Idol judge Simon Cowell uttered the phrase, “to be absolutely honest,” this was most often followed by a no-holds-barred critique, designed to pierce and punch as many holes in a hopeful Idol contestant’s ego and performance as possible.

Conversely, we tend to view singer-songwriter, Jimmy Buffet, as having a crowd of sixty to seventy thousand rabid fans parroting the chorus “Fins to the left and Fins to the right” in obvious delusional delight during any one of his annual concert tours. (I count myself as one of those multigenerational Parrotheads.)

Obviously, I’m very fond of the metaphorical and sometimes carry it a bit far – (I also miss Andy Rooney) – so how could Jimmy Buffet and Simon Cowell be synergistic?  Right!  They’re both richer than our wildest imaginations, but that’s not it.  And it’s not that Jimmy can sing and Simon has mastered only the negative phrases of the King’s English.

It isn’t even that we have in Simon, a battle-hardened producer, and in Jimmy, a singing airplane pilot – although the air and the battle-hardened parts are a clue.  More is revealed in the Buffet Anthem “Fins” where the chorus of “Fins to the left, Fins to the right” is characterized by the thousands of stadium fans with their hands skyward, palms together, waving rhythmically from left to right while joining in the lyric.   Cowell’s annoying habit of punching holes in anyone’s performance is also legendary.

You see where this is headed, right?

These two Icons have unknowingly spawned the final installment in a four chapter subset of the MicroTCA specifications.  The PICMG working group is finalizing the details for what will be abbreviated as MicroTCA.2.  It is a hardened specification (designed to meet multiple levels of military shock and vibration environments) and it features the side benefit of hybrid cooling.

The forced air pathways, provided through a carefully crafted array of orifices in the sidewalls of the chassis, combine with the inherent conduction-cooling elements of clam-shelled AMC modules. Those same modules are coupled to the rugged chassis’ cold walls using hybrid vented card retainers.

Cooling fins would be employed along the clamshells for primary cooling of the higher powered modules using a flow through ventilation scheme proposed in the figure below,

Proposed MicroTCA.2

The resultant product will be the final planned addition to the more recently ratified dot specs. – Rugged MicroTCA.1, Conduction Cooled MicroTCA.3, and MicroTCA.4, which added rear transition modules to significantly extend the computational power of the platform for use in physics and timing applications.

MicroTCA.2 and its Mil environments are represented in the proposed chart above.

In early November Mark Leibowitz, BAE Systems Chief Systems Architect and Chair of the PICMG MicroTCA.2 working group presented a comparison of the ratified MicroTCA.3 Conduction Cooled platform and the proposed companion MicroTCA.2 platform at the annual Advanced/MicroTCA Summit.   The two graphics included here were part of Mark’s presentation.

In mid November, an extensive characterization test was performed to validate the thermal capabilities of an exemplar Hardened Hybrid Air/Conduction Cooled MicroTCA.2 system. The results of that testing is expected to provide data, confirming not only the overall thermal behavior of typical slots populated with various combinations of high power, low power and filler modules, but also quantifying the contribution of thermal conduction to the sidewalls in the proposed specification.

It is anticipated that finalization of the spec and ratification will be completed early in Q1 2012.

A final thought: Fins to the left” could be VPX, and Fins to the right” could be MicroTCA.2.

Stay tuned for more shark sightings.

Steve Richardson is the CBT Technology (formerly XTech) representative on the PICMG MicroTCA.2 working group.

Microtca – Moving Into the Field

Thursday, November 11th, 2010

By Laurie Burger; Chief Marketing Officer

XTECH PRODUCTS

Microtca, in a myriad of different configurations (some simple – some complex), is quickly working its way into a wide range of applications where environment, shock, and vibration are all a factor.  Some of the keys to Microtca’s short term success are:

  • Options for low cost/simplified backplane and management schemes
  •   Robust packaging (for the chassis and boards)
  •   Cost effective boards for fabrics including PCI express.

From the packaging perspective, alternative front panel solutions such as the flanged version with the retention screw (Figure 1)  address the need for a more robust method of securing the AMC’s into the chassis – beyond the typical press fit solution (Figure 2).

Flanged uTCA with Retention Screws

Figure 1, Flanged AMC with Retention Screws

AMC Panels and the XTech XTractor

Figure 2, Standard AMC Front Panel

While not fully ‘ruggedized’ – a robust flange solution insures the boards will be tightly and securely mounted in the chassis despite challenging shock and vibration environments often found in transportation,  factory floor process control,  and vehicle mounted monitoring devices.

Many applications do not require ‘full ruggedization’ – but do need a level of robustness beyond the typical commercial products.   As shown in the images below, Microtca is being adapted for transportation and other ruggedized requirements by OEM’s today.  We anticipate this trend to continue.

uTCA Front Panels in Chassis

Figure 3, Microtca in Robust Chassis

uTCA Front Panels in Robust Chassis
Figure 4, Microtca in Robust Chassis