by Steve Richardson

Not long ago, I figured it was time to dust off the crystal ball again.  No, it wasn’t to predict the outcome of the mid-term elections – I wouldn’t wager on anything as unpredictable as that.)  Rather, I was attempting to get a fix on the breed of VPX likely to enter the ring as the most popular contender in need of rugged mechanical circuit board systems support.

(I had to admit that after integrating the Triple E brand, with its treasure chest of rugged inject and eject handles, card guide systems, and chassis into our XTech facility; we had accomplished a step-function growth spurt in capabilities.)

So here comes VITA 48.1, 48.2 and 48.3, also known as the cooling triplets, Air Cooled, Conduction Cooled, and Liquid Cooled.  Just in VITA 48.1 alone, there is a trio of pitches from which to choose – 4 HP (0.80”), 4.25 HP (0.85”), and 5 HP (1.00”).  As luck would have it, we were already extruding both 4 HP and 5 HP style front panels in fabric over foam and metal shielding profiles.

It was the 4.25 HP pitch which had me stymied.  Rather than toss a coin, I consulted several “trusted sources” on the likelihood of both its adoption rate, and whether we would see more of the foam-based or metal-based EMI shield types. Since my “trusted sources” were going to use coins as well, I took a leap of faith and sprang for the foam-based die profile. Within a week we had some 4.25 HP metal on the shelf.

Most of what is percolating in the market continues to be 5 HP and the ever popular 4 HP from 1101.10. As for 4.25, we have built it, but will they come?

Steve Richardson